Abstract
Book - 3D IC Heterogeneous Integration by FOWLP
Cite
CITATION STYLE
APA
Lau, J. H. (2018). 3D IC Heterogeneous Integration by FOWLP. In Fan-Out Wafer-Level Packaging (pp. 269–303). Springer Singapore. https://doi.org/10.1007/978-981-10-8884-1_11
Register to see more suggestions
Mendeley helps you to discover research relevant for your work.
Already have an account? Sign in
Sign up for free