CITATION STYLE
Ho, P. S., Lee, K.-D., Pyun, J. W., Lu, X., & Yoon, S. (2006). Dielectric and Scaling Effects on Electromigration for Cu Interconnects. In Materials for Information Technology (pp. 225–239). Springer-Verlag. https://doi.org/10.1007/1-84628-235-7_20
Mendeley helps you to discover research relevant for your work.