Effect of stress wave between adjacent asperities interaction on subsurface damage of optical glass in precision grinding

Abstract

The interaction between adjacent asperities is a typical characteristic of the grinding process and plays an important role in the material removal mechanism. Therefore, in order to systematically investigate the formation mechanism of the subsurface damage, a precision grinding contact model between the diamond particle and optical glass with adjacent asperities is proposed in our research. The initiation and propagation mechanism of median/lateral cracks under residual stress, the propagation rules of the stress waves on the subsurface, and the interaction between the subsurface damage under stress superposition effect are fully investigated by a theoretical analysis and finite element simulation. The simulation results of the precision grinding model are verified by experiments, which show that the proposed numerical analysis model is reasonable and the finite element analysis process is feasible.