Integrated photonics for space applications

Abstract

Since the flourish of the space technology, microelectronic integrated circuits can no longer meet the urgent requirement of the space-based systems in terms of transmission capacity, communication speed and electromagnetic compatibility. The conventional space-based optoelectronic systems are now based on a bulk optical device, which have been seen to possess some fundamental restrictions as regards its size, weight, power and cost. Integrated photonics provides an ideal solution for the above bottlenecks that existed in current space-based systems, and this tends to be an emerging research focus in recent years. In this paper, we focused on the technology of integrated photonics for space applications. First, we briefly introduced the characteristic and the development of several main material platforms for integrated photonics, which are indium phosphide, silicon, and silicon nitride and thin-film lithium niobate. Then, we systematically reviewed the progress of the integrated photonics for various fields of space-based application: high-speed laser communication, microwave photonics, optical sensing, biological health, autonomous navigation and astronomy imaging. The recent breakthrough, which is related to the working principles and critical limitations of these space-based integrated photonics technologies, has been described in detail. Since its operation is utilized in practical space missions and satellites, the integrated photonics devices should therefore, undergo testing of harsh space environments, especially under exposure to different forms of ionizing radiation. Therefore, we also analyze the radiation effects and reliability of the integrated photonics devices which are based on different material platform. Finally, the main achievements which have been recorded in the space-based integrated photonics technology are summarized and the future prospects presented: (i) reducing the power consumption of the integrated photonics circuits; (ii) realizing the photonics chip package with high reliability; (iii) industrialization and low-cost fabrication for the optoelectronic integration.