Soft, embeddable, dry EEG sensors for real world applications

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Abstract

Over the last decade, numerous papers have presented the use of dry electrodes capable of acquiring electroencephalogram (EEG) signals through hair. A few of these dry electrode prototypes have even progressed from lab-based EEG acquisition to commercial sales. While the field has improved rapidly as of late, most dry electrodes share a number of shortcomings that limit their potential real world applications including: 1) multiple rigid prongs that require sustained pressure to penetrate hair and maintain solid scalp contact, creating higher levels of discomfort when compared to standard wet sensors; 2) cumbersome or chin-strap-type applications for maintaining electrode contact, creating barriers to end user acceptance; 3) rigid active electrodes to compensate for high input impedances that limit flexibility and placement of sensors; 4) inability to safely imbed sensors under protective headgear, restricting use in some fields where EEG metrics are most desired; and 5) expensive sensor manufacturing that drives costs high for use across subjects. Under a recent DARPA Phase 3 contract, Advanced Brain Monitoring has developed a novel semi-dry sensor that addresses the current dry electrode shortcomings, opening up the door for new real world applications without compromising subject safety or comfort. The semi-dry sensor prototype was tested during a live performance requirement at the end of Phase 3, and successfully acquired EEG across all subject hair types over a 3 day testing period. The results from the performance requirement and subsequent results for new advancements to the prototype are presented here. © 2013 Springer-Verlag Berlin Heidelberg.

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APA

Davis, G., McConnell, C., Popovic, D., Berka, C., & Korszen, S. (2013). Soft, embeddable, dry EEG sensors for real world applications. In Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics) (Vol. 8027 LNAI, pp. 269–278). https://doi.org/10.1007/978-3-642-39454-6_28

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