Effect of Linear Aliphatic Polyamines on Copper Removal Rate in Chemical Mechanical Planarization (CMP)

Abstract

The role of homologous linear aliphatic polyamines as additives in Cu CMP slurries was investigated. We show that, in addition to forming stable complexes with copper ions in solution, the polyamines also interact with the copper metal preventing its corrosion. The latter effect increases with the polyamine chain length making the superior members of the homologues series effective passivating agents. A mechanism that explains the trend in the anticorrosion activity of polyamines is proposed.