Application of data mining for improving yield in wafer fabrication system

Abstract

This paper presents a comprehensive and successful application of data mining methodologies to improve wafer yield in a semi-conductor wafer fabrication system. To begin with, this paper applies a clustering method to automatically identify AUF (Area Uniform Failure) phenomenon from data instead of visual inspection that bad chips occurs in a specific area of wafer. Next, sequential pattern analysis and classification methods are applied to find out machines and parameters that are cause of low yield, respectively. Finally, this paper demonstrates an information system, Y2R-PLUS (Yield Rapid Ramp-up, Prediction, analysis & Up Support) that is developed in order to analyze wafer yield in a Korea semiconductor manufacturer. © Springer-Verlag Berlin Heidelberg 2005.