Chip-off Success Rate Analysis Comparing Temperature and Chip Type

Abstract

Throughout the digital forensic community, chip-off analysis provides examiners with a technique to obtain a physical acquisition from locked or damaged digital device. Thermal based chipanalysis relies upon the application of heat to remove the flash memory chip from the circuit board. Occasionally, a flash memory chip fails to successfully read despite following similar protocols as other flash memory chips. Previous research found the application of high temperatures increased the number of bit errors present in the flash memory chip. The purpose of this study is to analyze data collected from chip-off analyses to determine if a statistical difference exists between the removal temperatures of flash memory chips successfully and unsuccessfully read by using a t-test, F-test and an analysis of variance (ANOVA). The results from the statistical evaluation showed no statistical difference between the groups of memory chips successfully and unsuccessfully read, as well as, between older and newer types of Ball Grid Array (BGA) memory chips.