Abstract
Nanoindentation constitutes a powerful method for measuring the mechanical properties and the interface fracture toughness of thin films on substrates. In the case of a brittle film weakly bonded to the substrate nanoindentation can be used to delaminate the film from the substrate. The interface toughness is obtained from measurements of the applied load, delamination length, film thickness and film/substrate material properties.
Cite
CITATION STYLE
APA
Gdoutos, E. E. (2020). Nanoindentation. In Solid Mechanics and its Applications (Vol. 263, pp. 371–385). Springer. https://doi.org/10.1007/978-3-030-35098-7_13
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