Thin wafer handling and processing without carrier substrates

Abstract

SiP (system in package), IC cards and RFID (radio frequency identification) tags are more commonly used in digital and mobile devices, such as cell phones, and along with such recent trends, 30-50 μm thick product die are actually used. The thinning of silicon wafers to enhance performance is also in strong demand in power devices used for power conversion, such as IGBTs (insulated gate bipolar transistors) used in solar power generation and hybrid vehicles, which are attracting attention for energy conservation and global environmental protection. This chapter introduces the process technology of making wafers thinner, which also considers wafer handling and use in the subsequent steps, in anticipation of even further thinning of wafers. © 2011 Springer Science+Business Media, LLC.