Abstract
Book - 3D IC Heterogeneous Integration by FOWLP
Cite
CITATION STYLE
APA
Lau, J. H. (2018). Fan-in Wafer-Level Packaging Versus FOWLP. In Fan-Out Wafer-Level Packaging (pp. 69–113). Springer Singapore. https://doi.org/10.1007/978-981-10-8884-1_3
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