Evaluation of different LED light-curing devices for bonding metallic orthodontic brackets

Abstract

The aim of this study was to assess the influence of different light-emitting diodes (LED) light-curing devices for bonding orthodontic brackets, using the shear bond strength and analysis of adhesive remnant index (ARI). Crowns from 60 bovine incisors received brackets bonded with Transbond XT. Specimens were divided into 4 groups (n=15) according to the light-curing procedures: HL = control, halogen light; OR = Ortholux LED; UL = Ultraled XP, and RD = Radii LED. All light-curing procedures were performed for 40 s. Shear bond strength test was evaluated using an universal testing machine at a crosshead speed of 0.5 mm/min. Data were analyzed statistically by ANOVA and Tukey's test. The ARI scores were evaluated with a stereoscopic magnifying glass and analyzed statistically by Kruskal-Wallis test. A significance level of 5% was set for all analyses. Shear bond strength means in MPa and standard deviations were 9.82 (3.28), 12.70 (3.35), 9.04 (2.80) and 11.22 (2.36) for HL, OR, UL and RD, respectively. OR presented the highest shear bond strength mean value. HL differed significantly (p<0.05) from Groups OR and RD. However, these groups did not differ significantly from each other (p>0.05). Regarding the ARI scores, no statistically significant difference was observed (p>0.05) among the groups. In conclusion, Ortholux LED and Radii LED units provided the highest values of bracket adhesive strength.