3D-IC technology using ultra-thin chips

Abstract

Various generic methods for the three-dimensional (3D) integration of integrated circuits (ICs) are discussed. All these methods rely on ultra-thin chips. Wafer-to-wafer bonding, chip-to-wafer bonding, multichip-to-wafer bonding and reconfigured wafer-to-wafer bonding are described and compared. Several test chips fabricated by that use some of those concepts are briefly mentioned. Finally, specific concerns related to 3D-IC integration that use ultra-thin chips are indicated. © 2011 Springer Science+Business Media, LLC.