Providing Complex Cyber-Physical Systems (C-CPSs) more efficiently and faster is a goal that requires improvements in engineering process for producing high-quality, advanced engineering artifacts. Furthermore, information securitymust be a top priority when engineering C-CPSs as the engineering artifacts represent assets of high value. This chapter overviews the engineering process of C-CPSs, typically longrunning technical systems, such as industrial manufacturing systems and continuous processing systems.This chapter also coversmajor areas of requirements that include: (a) processes with intensive generation of engineering artifacts; (b) challenges regarding dependencies and complexity of engineering artifacts, stemming from variants of a product and the associated production process for a family of products; (c) management of model and consistency rules for dependencies between model parts; (d) the internationalization of the engineering process with partners on different levels of trust; and (e) the security of the engineering processes, such as confidentiality of engineering plans, and the security of the systems to be engineered, such as security aspects in the design phase. For selected requirement areas, the chapter discusses several approaches for quality improvement from business informatics that addresses important classes of requirements, but introduces new complexity to the engineering process. Therefore, the chapter reviews information security improvement approaches for engineering processes, including the consideration of new security requirements stemming from risks introduced by advanced informatics solutions. Finally, the chapter provides an overviewon the book parts and the contributions of the chapters to address advanced engineering process requirements.
CITATION STYLE
Biffl, S., Eckhart, M., Lüder, A., & Weippl, E. (2019). Introduction to Security and Quality Improvement in Complex Cyber-Physical Systems Engineering. In Security and Quality in Cyber-Physical Systems Engineering (pp. 1–29). Springer International Publishing. https://doi.org/10.1007/978-3-030-25312-7_1
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