Influence Evaluation of Tungsten Content on Microstructure and Properties of Cu-W Composite

Abstract

At present, most studies focus on Cu-W composites with high W content (W content > 50 wt%), while there are only sporadic reports on Cu-W composites with low W content (W content < 50 wt%). In this work, Cu-W composites with different W contents (0, 10 wt%, 20 wt% and 30 wt%) were prepared, and the effects of W content on microstructure, density, hardness, electrical conductivity, strength and electrical contact properties were systematically studied, with the expectation of providing an experimental basis and theoretical support for expanding the application range of Cu-W composites with low W content. The results showed that, with the increase in W content, the Cu matrices divided into finer and more uniform grains; the density and electrical conductivity of Cu-W composites decreased; and the compressive yield strength and hardness gradually increased. As the content of W increased, the arc burning time of the Cu-W composite contacts began to fluctuate. There was a loss of both the cathode and the anode contacts of the pure Cu, but the mass transfer of the Cu-W composite contacts occurred as follows: the anode weight increases, while the cathode weight decreases. The addition of W particles changed the non-uniform ablation of the pure Cu, and the surface ablation of the Cu-W composite contacts remained uniform.