The manufacture of semiconductor devices may include dozens of process steps, all delicately choreographed to produce a functioning, reliable, and efficient device. These steps, such as photolitography, etching and deposition, act to shape and mold the device, replete with various metals, insulators, and interconnects. As one might guess, a trial and error approach to determine a repeatable and reliable recipe is not inexpensive. Numerical simulations which capture the essential details of these processes have a valuable role to play.
CITATION STYLE
Sethian, J. A. (2005). Modern Interface Methods for Semiconductor Process Simulation. In Handbook of Materials Modeling (pp. 1359–1369). Springer Netherlands. https://doi.org/10.1007/978-1-4020-3286-8_67
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