Warpage measurement of simulated electronic packaging assembly

Abstract

Digital image correlation is an attractive displacement measurement method for thermo-mechanical characterization and simulation of electronic assemblies, but faces a number of challenges to implementation. In this paper, a batch reflow oven with a large window was used to allow for optical measurements of an assembly under simulated production reflow conditions, and the results were compared to those from a finite element model. The testing and modeling methods are described, and their results are compared. © The Society for Experimental Mechanics, Inc. 2014.