CITATION STYLE
Zhu, X., Santhanam, S., Lakdawala, H., Luo, H., & Fedder, G. K. (2001). Copper Interconnect Low-K Dielectric Post-CMOS Micromachining. In Transducers ’01 Eurosensors XV (pp. 1520–1523). Springer Berlin Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_359
Mendeley helps you to discover research relevant for your work.