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Journal Article

Nonlinear Mechanical Properties of Solder Alloys and Reliability Design for Thermal Fatigue

Journal of Japan Institute of Electronics Packaging (2005) 8(2) 150-155
DOI: 10.5104/jiep.8.150
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Kariya, Y., & Mukai, M. (2005). Nonlinear Mechanical Properties of Solder Alloys and Reliability Design for Thermal Fatigue. Journal of Japan Institute of Electronics Packaging, 8(2), 150–155. https://doi.org/10.5104/jiep.8.150

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