Numerical analysis of curing residual stress and deformation in thermosetting composite laminates with comparison between different constitutive models

Abstract

A multi-physics coupling numerical model of the curing process is proposed for the thermosetting resin composites in this paper, and the modified "cure hardening instantaneously linear elastic (CHILE)" model and viscoelastic model are adopted to forecast residual stress and deformation during the curing process. The thermophysical properties of both models are evolved in line with temperature and degree of cure (DOC). Accordingly, the numerical simulation results are improved to be more accurate. Additionally, the elastic modulus of the materials is calibrated to be equal to the modulus of viscoelastic relaxation by a defined function of time in the CHILE model. Subsequently, this work effectuates the two proposed models in a three-dimensional composite laminate structure. Through comparing the two numerical outcomes, it is customary that the residual stress and deformation acquired by the modified model of CHILE conform to those ones assessed through adopting the viscoelastic model.