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Copper CVD for Conformal Ultrathin-film Deposition

  • Joulauda M
  • Doppelt P
Springer-Verlag, (2006), 51-59
DOI: 10.1007/1-84628-235-7_5
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Joulauda, M., & Doppelt, P. (2006). Copper CVD for Conformal Ultrathin-film Deposition. In Materials for Information Technology (pp. 51–59). Springer-Verlag. https://doi.org/10.1007/1-84628-235-7_5

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