The formation of microcrystalline silicon was investigated employing the layer-by-layer technique with very high frequency plasma excitation. Etching of the deposited layers was found to be a dominant effect during hydrogen plasma treatment. Microcrystalline growth occurred when the thickness of the deposited layer was reduced to a certain value in each cycle. The etching stopped when a noticeable crystalline volume fraction was produced; for long hydrogen treatment times no film growth was observed. © 1999 American Institute of Physics.
CITATION STYLE
Vetterl, O., Hapke, P., Houben, L., Finger, F., Carius, R., & Wagner, H. (1999). Connection between hydrogen plasma treatment and etching of amorphous phase in the layer-by-layer technique with very high frequency plasma excitation. Journal of Applied Physics, 85(5), 2991–2993. https://doi.org/10.1063/1.369616
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