Fabrication and characterization of YSZ thin films for SOFC application

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Abstract

Yttria stabilized zirconia (YSZ) thin films are deposited on thin Si3N4 layer coated Si substrates by RF-sputtering with different substrate temperatures, room temperature (YSZ-RT) and 550-C (YSZ-550). Fine polycrystalline structure is observed for YSZRT (thickness = 620 nm), while columnar crystal structure (111) oriented for YSZ-550 (thickness = 660 nm), respectively. The conductivity measurement shows that the activation energies of YSZ-RT and YSZ-550 are 1.34 and 1.58 eV, respectively, indicating that grain boundary conduction is dominant. Shear strengths of the YSZ films are determined by using a micro-blade cutting system to be 150MPa for YSZ-RT and 200MPa for TSZ-550, respectively. YSZ-550 is found to be better for solid oxide fuel cell application from mechanical and electrically properties point of view.

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Suzuki, T., Suzuki, T., Yamaguchi, T., Sumi, H., Hamamoto, K., Fujishiro, Y., & Shin, W. (2015). Fabrication and characterization of YSZ thin films for SOFC application. Journal of the Ceramic Society of Japan, 123(1436), 250–252. https://doi.org/10.2109/jcersj2.123.250

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