Temperature Prediction on Flexible Printed Circuit Board in Reflow Oven Soldering for Motherboard Application

Abstract

Flexible printed circuit boards (FPCBs) appoint an interest in current electronics devices with unique capabilities in the form of flexibility, lightweight, and thin thickness. In this paper, the proposed of that utilises FPCB as a substrate for motherboards is investigated. Assembly surface variation temperature in the reflow soldering process is a crucial factor to address the feasibility of substrate for surface mount technology (SMT) applications. For thin FPCB, higher Reynold number (Re) would not give the significant effect of heat transfer on assembly surface temperature. Although the primary focus is in a continuous reflow oven, FPCB findings could enhance the information for other FPCB applications such as designing the soldering thermal profile.