Abstract
Methods to transfer a pattern into porous silicon using light are reviewed. These methods can be applied before, during, or after the anodization processes. The advantages and disadvantages of each method are noted and technical performance compared using the aspect ratio of the pattern transferred into the porous silicon as a key metric. Based on this comparison, it is possible to group the various methods in a manner that allows specific applications to use the most appropriate patterning method.
Cite
CITATION STYLE
Keating, A. (2014). Photolithography on porous silicon. In Handbook of Porous Silicon (pp. 531–539). Springer International Publishing. https://doi.org/10.1007/978-3-319-05744-6_54
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