P‐117: Analysis for LED Junction Temperature in LCD Module Based on Numerical Simulation

  • Chen Y
  • Lin M
  • Huang K
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Abstract

In this paper, we discuss the junction temperature of LED in the LCD module. The lifetime of LED strongly depends on the junction temperature. Besides, the optical performance of LED will decay with the rise of junction temperature. Mura of LCD module may occur due to non‐uniform decay of the LEDs, which are the light sources of LCD module. Besides forward current and voltage, package material, PCB and LCD module design will also affect the LED junction temperature. By using numerical analysis, we can understand the parameters that strongly affect the LED junction and improve the quality of LCD with LED backlight. Lead frame material of LED package, dielectric layer of the PCB, and the back cover of LCD module are discussed in this paper to have a good thermal performance of the LCD module with LED backlight.

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Chen, Y., Lin, M., & Huang, K. (2008). P‐117: Analysis for LED Junction Temperature in LCD Module Based on Numerical Simulation. SID Symposium Digest of Technical Papers, 39(1), 1629–1632. https://doi.org/10.1889/1.3069478

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