Thermal Compatibility of Rigid and Flexible Adhesives to Substrates of Historical Structures

Abstract

This paper presents influence of thermal stress factors of various adhesives and substrates on generation of stress in heritage structures. Comparison of them indicates that flexible polyurethane adhesives decrease peaks of stress concentrations significantly in accordance to stiff epoxy ones. Moreover, flexible polyurethanes work stable in elevated temperatures, because the exploitation range of temperatures covers area of stable mechanical properties behind the glass transition of the polyurethanes. The carried out SLST in normal and elevated temperatures, made on stiff and flexible adhesives and on substrates of various stiffness, confirmed that the tested flexible polyurethane PS adhesive is stable and compatible to heritage substrates.