Handling of thin dies with emphasis on chip-to-wafer bonding

Abstract

Thin dies with all their advantages bear various new challenges for die handling during die attach or flip-chip processes. The changed properties, like increased brittleness as well as higher flexibility of the dies, have to be addressed accordingly with new concepts for effective detachment from the wafer tape, low stress handling during transfer and adhesion processes that need to be chosen more carefully for each application. In this chapter various ejection principles and handling tool examples are described together with a few product applications that have gained in importance for mass production because of the development towards ultra-thin dies. Three-dimensional integration using through silicon vias and dies embedded in polymer are two examples of applications that became possible only by the introduction of thin dies. © 2011 Springer Science+Business Media, LLC.