Homologous temperature dependence of global surface scaling behaviors of polycrystalline copper films

Abstract

A strategy integrating structure zone model with dynamic scaling theory was proposed to study the global surface dynamics of polycrystalline Cu films deposited at different homologous temperature Ts / Tm. The evolution of roughness exponent α and growth exponent Β reveals a transition from random deposition to surface diffusion dominated smoothening in the lower Ts / Tm regime and then to rapid surface roughening in the higher Ts / Tm regime. In contrast to that of amorphous films, the distinct scaling behavior in higher Ts / Tm regime arises from the change of anisotropic mass transport mechanisms, which could be related to the texture evolution during growth. © 2009 American Institute of Physics.