Hydrodynamic analysis of circular translational polishing under mixed lubrication

Abstract

The average Reynolds equation and average clearance equation of circular translational polishing (CTP) under the quasi-stable mixed lubrication state are set up in polar coordinates. The distributions of fluid pressure and contact pressure during polishing are numerically analyzed by solving simultaneously these equations along with the contact pressure equation. The effects of various process parameters on hydrodynamic performance of CTP are analyzed. By comparing the distributions of periodic average pressure along radial direction under fully and partially lubricated states, we conclude that carefully controlled CTP under mixed lubrication is beneficial to improving the surface quality and planarity of the wafer.