Cooling Of Electronic Equipments with Heat Sink: A Review of Literature

Abstract

High heat flux of electronic devices, e.g. projector, LED, high power chip, etc., require efficient cooling methods for heat dissipation in a limited region. It means maintaining a small heat source at an acceptable temperature. This resulted in inevitable challenges in the field of thermal management of electronics to maintain the desirable operating temperature. The present paper reviews the literature dealing with various aspects of cooling methods. Included are papers on experimental work on analyzing cooling technique and its stability, numerical modeling, natural convection, and advanced cooling methods. The issues of thermal management of electronics, development of new effective cooling schemes by using advanced materials and manufacturing methods are also enumerated in this paper.