The identification of internal defects in integrated circuits with the use of acoustic microscopy

Abstract

The paper presents a methodology for identifying internal defects in integrated circuits and determining their type using scanning acoustic microscopy. Examples of images of the most common defects in various projections are given. The presence of defect was confirmed by optical inspection of samples' cross-section. The presented data will be useful to specialists in ultrasonic testing to identify inconsistencies in the process of packaging integrated circuits.