A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level

0Citations
Citations of this article
5Readers
Mendeley users who have this article in their library.

Abstract

The wafer-level packaging (WLP) process invented allows hermetic capping of optical devices on wafer-level yielding miniaturized glass cavity windows on top of the optical area, at the same time leaving the contact area accessible for standard electrical connections i.e. wire bond. These smaller chip-size optical cavity packages are used within standard chip-on-board (COB) assemblies for high performance optical applications providing high yields and utmost reliability. © 2009.

Cite

CITATION STYLE

APA

Maus, S., Hansen, U., Leib, J., & Töpper, M. (2009). A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level. In Procedia Chemistry (Vol. 1, pp. 1527–1530). https://doi.org/10.1016/j.proche.2009.07.381

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free