We have demonstrated a novel method of depositing ALD-Al2O3/PECVD-SiO2 bi-layer dielectric to passive the surface channels of the hydrogen-terminated diamond (H-diamond). After Al2O3/SiO2 passivation, the surface current increased with time and then tended to be saturated. Afterwards, it became much more stable and showed a larger current than an unpassivated counterpart. The H-diamond MOSFETs were fabricated by using this bi-layer passivation structure and an extremely low Ohmic contact resistance of 0.87~Omega cdot mm was obtained. The H-diamond RF MOSFET with gate length of 0.45~{mu }text{m} achieved a high current density of -549 mA/mm and an extrinsic {f} -{mathrm{ T}}/{f}-{max } of 15/36 GHz. By load-pull measurement, a high output power density of 1.04 W/mm was obtained at frequency of 2 GHz. The results reveal that it is a promising solution for high-stable and high-power diamond transistors by using the Al2O3/SiO2 bi-layer passivation.
CITATION STYLE
Yu, X., Hu, W., Zhou, J., Liu, B., Tao, T., Kong, Y., … Zheng, Y. (2021). 1 W/mm Output Power Density for H-Terminated Diamond MOSFETs with Al2O3/SiO2Bi-Layer Passivation at 2 GHz. IEEE Journal of the Electron Devices Society, 9, 160–164. https://doi.org/10.1109/JEDS.2020.3046603
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