In-rich InGaN thin films: Progress on growth, compositional uniformity, and doping for device applications

Abstract

A number of In-rich InGaN films with In contents in the 20–40% range have been grown at moderately low temperatures on sapphire and silicon substrates at high growth rates using a versatile molecular beam epitaxy-type technology that utilizes an energetic beam of N atoms called energetic neutral atom beam lithography and epitaxy to overcome reaction barriers in the group III-nitride system. Extensive characterization results on the crystalline, optical, and electrical properties of the In-rich InGaN materials are reported. It was found that N-rich growth conditions are required to produce materials that have excellent crystallinity, uniform compositions, and bright band edge photoluminescence. For In-rich InGaN growth on sapphire, electrical transport measurements show reasonably low carrier concentrations and high mobilities. Successful p-type doping of In-rich InGaN with ∼20% and ∼40% In contents is demonstrated, and preliminary results on the formation of a p–n junction are reported. For In-rich InGaN growth on Si, the film structural properties are somewhat degraded and carrier concentrations are considerably higher.