Building ceramics with improved thermal insulation parameters

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Abstract

One of the most important performance characteristics of masonry units is their high thermal insulation. There are many different ways to improve this parameter, however the most popular methods in case of ceramic masonry units are: Addition of pore-creating raw materials and application of proper hole pattern. This study was an attempt to improve thermal insulation of ceramics by applying thermal insulation additives. Perlite dust created as a subgrain from expansion of perlite rock was used. Perlite subgrain is not very popular among consumers, that's why it's subjected to granulation to obtain coarse grain. The authors presented concept of direct application of perlite dust for the production of building ceramics with improved thermal insulation. Fineness of this additive is asset for molding of ceramic materials from plastic masses. Based on the results it was found that about 70% perlite by volume can be added to obtain material with a coefficient of heat conductivity of 0,37 W/mK. Higher content of this additive in ceramic mass causes deterioration of its rheological properties. Mass loses its plasticity, it tears up and formed green bodies are susceptible to deformation. During sintering perlite takes an active part in compaction process. Higher sintering dynamics is caused by: high content of alkali oxides in perlite and glass nature of perlite. Alkali oxides generate creation of liquid phase which intensifies mass compaction processes. Active role of perlite in sintering process causes good connection of its grains with clay groundwork which is important factor for mechanical parameters of ceramic materials. It was also noted that addition of perlite above 40% by volume of mass effectively neutralized negative effect of efflorescence in ceramic materials.

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CITATION STYLE

APA

Rzepa, K., Wons, W., & Reben, M. (2016). Building ceramics with improved thermal insulation parameters. In E3S Web of Conferences (Vol. 10). EDP Sciences. https://doi.org/10.1051/e3sconf/20161000082

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