Opto-Electronic Packaging

Abstract

Optical transmission systems either for data communications or sensor applications will now use the high bandwidth and low attenuation of optical fiber in the optical frequency domain. Transmitter, receiver and sensor modules are basic elements of these systems. These devices should meet the specifications of different measurement systems like cost and performance especially for the connection between the fiber and the optical active device. Several concepts for fiber-chip coupling schemes have been proposed in the past. A strong challenge for packaging engineers is to create a flexible design of the set-up which is able to adapt different optical devices with changing dimensions to an existing module type. In this block, the packaging techniques of opto-electronic modules are described.