Simulation of the transient temperature distribution in a cooling apparatus for high-power semiconductor devices using heat pipes

Abstract

This study describes the transient temperature distribution in a cooling apparatus for high-power semiconductor devices used to drive motors of electric rolling stocks. The cooling apparatus is composed of heat pipes. In the model for simulation, we substituted solid elements for heat pipes, and determined their thermal properties by experiment. Consequently, the heat transfer rate of heat pipes can be obtained by a heat conduction analysis. Calculations show that when heat generation in the device changes, the temperature of cooling apparatus changes more slowly than that of the devices. A comparison between calculations and experiments confirms the accuracy of the modeling and prediction method.