CFD simulation on IC thermal cooling through water involved TiO2, ALN and CuO nanofluids

Citations of this article
Mendeley users who have this article in their library.
Get full text


In persevering courteousness, CFD codes got developed and run with water based TiO2, AlN and CuO nanofluids to envision the thermal alarms of ICs. The convective governing equalities of mass, force and drive are computed for envisaging the thermal issues of ICs. The time pace selected throughout the intact computation is 0.0001 s. The soundings affect CFD forecasts of temperature curve, temperature arena plus fluid-solid boundary temperature of IC. Corresponding fluid-solid boundaries temperatures of IC are viewed as 351, 312 and 338 K for water based TiO2, AlN and CuO nanofluids, respectively. The temperature of water-AlN nanofluid stands peak contiguous to the IC locality as it stands far less than the chancy temperature limit of 356 K. Further, the temperature of water-AlN nanofluid gently drops with improvement in aloofness from IC. Afterwards, this becomes surrounding temperature in the distant arena precinct. The analogous tinted temperature curve stands accessible. In addition, the congruent plot of temperature verses distance from IC stays publicized. The apprehension of CFD lenient stand adjacent to the facilities of expressions.




Kund, N. K. (2019). CFD simulation on IC thermal cooling through water involved TiO2, ALN and CuO nanofluids. International Journal of Innovative Technology and Exploring Engineering, 8(10), 1976–1980.

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free