Bridging a Gap in Thermal Conductivity and Heat Transfer in Hybrid Fibers and Yarns via Polyimide and Silicon Nitride Composites

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Abstract

The pressing issues of the energy crisis and rapid electronics development have sparked a growing interest in the production of highly thermally conductive polymer composites. Due to the challenges related to the poor processability of hybrid materials and filler distribution to achieve high thermal conductivity, electrospinning is employed to create composite nanofibers and yarns using polyimide (PI) and thermally conductive silicon nitride (SiN) nanoparticles. The thermal performance of the individual nanofibers is evaluated using scanning thermal microscopy (SThM), providing significant insights into their heat transfer performance. Next, the nanofibers are applied as coatings on resistance wires to assess the thermal conductivity and insulation properties. Notably, the samples containing 35 wt.% of SiN exhibit a 25% increase in surface temperature. These innovative materials hold great promise as exceptional candidates for smart textiles and thermal management applications, addressing the growing demand for effective heat dissipation and regulation.

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Moradi, A., Szewczyk, P. K., & Stachewicz, U. (2023). Bridging a Gap in Thermal Conductivity and Heat Transfer in Hybrid Fibers and Yarns via Polyimide and Silicon Nitride Composites. Small, 19(52). https://doi.org/10.1002/smll.202305104

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