Wafer curvature is a useful and sensitive technique for measuring stress in thin films. This work describes the basis for wafer curvature measurements and how they can be used to understand stress evolution. Various approaches to the measurement of curvature are discussed with their strengths and drawbacks. The information that can be obtained from wafer curvature is illustrated by.
CITATION STYLE
Chason, E. (2019). Stress measurement in thin films using wafer curvature: Principles and applications. In Handbook of Mechanics of Materials (pp. 2051–2082). Springer Singapore. https://doi.org/10.1007/978-981-10-6884-3_49
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