Reactive wetting by liquid sodium on thin Au plating

Abstract

For practical use of an under-sodium viewer, the behavior of sodium wetting is investigated by modeling the reactive and non-reactive wetting of metallic-plated steels by liquid sodium to simulate sodium wetting. The non-reactive wetting simulation results showed good agreement with Tanner's law, in which the time dependencies of the droplet radius and contact angle are expressed as RN∝t1/10 and θ∝t - 3/10, respectively; therefore, the model was considered suitable for the simulation. To simulate reactive wetting, the model of fluid flow induced by the interfacial reaction was incorporated into the simulation of non-reactive wetting. The reactive wetting simulation results, such as the behavior of the precursor liquid film and central droplet, showed good agreement with sodium wetting experiments using thin Au plating at 250 °C. An important result of the reactive wetting simulation is that the gradient of the reaction energy at the interface appeared on the new interface around the triple line, and that fluid flow was induced. This interfacial reactivity during sodium wetting of thin Au plating was enhanced by the reaction of sodium and nickel oxide through pinholes in the plating. © 2013 Atomic Energy Society of Japan.