This paper deals with ultra-precision grinding of chemical vapor deposited silicon carbide (CVD-SiC) for high power X-ray mirrors. CVD-SiC samples were ground by a numerically controlled surface grinder with variously-bonded diamond wheels, so as to get smooth surface roughness and high profile accuracy without a polishing process. SD4000-M wheel can grind CVD-SiC samples without fracture on the finished surface that is 3nm Ra in surface roughness and 0.3 μm in profile accuracy. Resinoid bonded wheels can easily get the smoother surface roughness, however, profile accuracy is limited at 0.9 μm due to the wheel deformation. The worn SD2000-M wheel can also get the ductile mode grinding on CVD-SiC samples. The surface fracture rate on ground surface strongly depends upon the grain size of diamond grits as well as the feed and depth of cut. © 1995, The Japan Society for Precision Engineering. All rights reserved.
CITATION STYLE
Suzuki, H., Hirano, M., Abe, M., Niino, Y., & Namba, Y. (1995). Ductile Grinding of Chemical Vapor Deposited Silicon Carbide for X-Ray Mirrors. Journal of the Japan Society for Precision Engineering, 61(4), 571–575. https://doi.org/10.2493/jjspe.61.571
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