Interface engineering in preparation of organic surface-emitting diodes

Abstract

Sputter deposition of indium tin oxide (ITO) on a buffered organic layer structure was performed to prepare a surface emitting organic light emitting diode (OLED). Is proven that a thin CuPc layer can be used as a buffer in reducing sputtering damage to the underlying OLED structure during ITO deposition. The use of a low work function metal is essential in preserving the OLED device efficiency.