Skip to main content
Book Chapter

Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section

  • Meyer M
  • Zienert I
  • Zschech E
Springer-Verlag, (2006), 485-495
DOI: 10.1007/1-84628-235-7_39
N/ACitations
Citations of this article
12Readers
Mendeley users who have this article in their library.
Get full text

Cite

CITATION STYLE

APA

Meyer, M. A., Zienert, I., & Zschech, E. (2006). Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section. In Materials for Information Technology (pp. 485–495). Springer-Verlag. https://doi.org/10.1007/1-84628-235-7_39

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free