Abstract
The metallurgy and mechanical behaviour of the principal solder types based on lead-tin alloys are reviewed. Particular emphasis is placed upon their performance under simulated service conditions, fatigue, creep and ageing, and life prediction. Requirements for improved and more environmentally compatible solders are explored. © 1996 Chapman & Hall.
Cite
CITATION STYLE
APA
Plumbridge, W. J. (1996). Solders in electronics. Journal of Materials Science. Springer Netherlands. https://doi.org/10.1007/BF00687275
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