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Dynamic buckling delamination of a bonded thin film under residual compression

  • Lee Y
  • Freund L
Springer Vienna, (1992), 147-160
DOI: 10.1007/978-3-7091-9223-8_11
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Lee, Y. J., & Freund, L. B. (1992). Dynamic buckling delamination of a bonded thin film under residual compression. In Advances in Dynamic Systems and Stability (pp. 147–160). Springer Vienna. https://doi.org/10.1007/978-3-7091-9223-8_11

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