Effect of thermal residual stresses on bonded structures containing cold expanded and bolted holes

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Abstract

The primary focus of this investigation is to determine the distribution of thermal residual stresses that result during composite bonding processes, and the effect on stresses generated during the subsequent cold expansion of holes. Residual stress measurements were carried out using neutron diffraction techniques. Results show that the cold expansion process resulted in radial compressive stresses 3-4 mm from the edge of the hole and there was no significant effect of thermal residual stresses from the bonding process on the cold expansion and bolted stresses. © (2014) Trans Tech Publications, Switzerland.

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APA

Syed, A. K., Fitzpatrick, M. E., & Moffatt, J. E. (2014). Effect of thermal residual stresses on bonded structures containing cold expanded and bolted holes. In Advanced Materials Research (Vol. 996, pp. 682–687). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/AMR.996.682

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