Abstract
This chapter reviews materials and processing for fabricating organic substrates including laminate substrates for plastic BGA (PBGA), build-up substrates for flip chip BGA (FCBGA), tape substrate for tape BGA (TBGA), coreless substrate, and some specialty substrates such as substrates for RF modules, high performance substrates with low dielectric constant, and substrate with embedded components (active dies or passives). Future trend of organic substrate development is also covered in this chapter. © 2009 Springer-Verlag US.
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CITATION STYLE
Appelt, B. (2009). Advanced substrates: A materials and processing perspective. In Materials for Advanced Packaging (pp. 243–271). Springer US. https://doi.org/10.1007/978-0-387-78219-5_7
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