Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy

Abstract

Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their microhardness and mechanical properties. Microhardness, tensile strength and elastic modulus increase with Bi addition while ductility decreases with Bi addition.